Bishnu Kingkar Gogoi Borah - Contact Centre Associate, Webhelp India Limited

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Work Background

Versana Micro Inc.Founder and CEO

Mar. 2014Scottsdale, Arizona, USATechnology for the Internet of Things

University of Utah Department of Electrical EngineeringAdjunct Professor

Feb. 2013Greater Salt Lake City Area

ZansorsCo-Founder and Chief Technology Officer

Jul. 2012 - Dec. 2012McLean, VATechnology for Healthcare

AXTEC Consulting GroupPresident

Jan. 2012Phoenix, Arizona AreaTechnical Consulting in Semiconductors and MEMS • Provide consulting services for MEMS Technology including sensor design, TCAD modeling, development, process integration, failure analysis, project management • Provide consulting services for discrete and integrated Semiconductor devices, mixed signal integrated circuit technology, CMOS integration, TCAD modeling, process integration, project management • Provide consulting services for Microfluidics and Biotechnology including design, development, modeling of microfluidic components and systems • Provide consulting services for Package development, thermal management and media compatibility for discrete and integrated sensors, discrete and integrated semiconductors, microfluidic and biotech devices • Provide consulting services for technology assessment and analysis, due diligence and Intellectual Property management

HVVi Semiconductors IncVP and CTO

Dec. 2010 - Aug. 2012VP & CHIEF TECHNOLOGY OFFICER HVVi Semiconductors, Inc., Phoenix, AZ 12/10 – 07/12 • Responsible for development of technology related to high power RF devices, high reliability chip-chip bump technology, • Responsible for development and design of high speed switching power management devices, Smart Power Integrated Circuits, CMOS integrated systems technology, high quality passives • Develop and Manage Intellectual Property Portfolio

HVVi Semiconductors IncDirector, Technology Development

Sep. 2006 - Feb. 2011• Responsible for development of technology related to high power RF devices, switching power management devices, Smart Power Integrated Circuits, CMOS integrated systems technology, high quality passives • Development of backend technology for high power RF devices including wafer level bumping • Develop and Manage Intellectual Property Portfolio

Evigia SystemsVP of MEMS Technology

Dec. 2005 - Aug. 2006Ann Arbor, MI• Responsible for MEMS technology development and commercialization of high-performance sensing systems. • Concept, design and development of Active RFID sensors with multi-sensor integration with Interface Circuits and communication systems • Collaboration with Indian Head Naval Base, Maryland, on Ordnance Condition Monitoring using multi-sensor platform • Collaboration with Wright-Patterson Air Force Labs, Dayton, Ohio, on Multi-axis blast detection • Principal Investigator with Natick Army Research Lab, MA, on Wireless Parachute Pressure Sensor Measurement System • Develop and manage Intellectual Property portfolio

Freescale SemiconductorDistinguished Member of the Technical Staff

Jan. 2000 - Dec. 2005• Develop technology for integration for autonomous systems and networks • Develop technology thrust in office of Chief Technology Officer, Freescale, for integration in autonomous systems and wireless sensor network technology using sensors, microcontrollers and RF ICs • Chief technologist in SOI inertial sensor technology platform including wafer level packaging in joint development program with LETI – CEA (a division of the French Nuclear Agency) and eventual transfer for manufacturing in Sendai , Japan • Develop sensor technology for applications in cellular phones and other portable electronic devices • Develop Intellectual Property portfolio for Freescale Semiconductor • Evaluate new technology opportunities for applications and recommend to management further actions. • Assess intellectual property issues from technology perspective and support upper management in partnership/licensing agreements • Collaborate with MTU (Michigan Technological University) on development of low temperature CMOS compatible MEMS technology and porous silicon • Industrial liaison with university consortiums – WIMS (Wireless Integrated MicroSystems), University of Michigan/National Science Foundation center, BSAC (Berkeley Sensors and Actuators Center), University of California, Berkeley/NSF center, MIT Media Lab

MotorolaStaff Device Engineer

Jun. 1997 - Nov. 2000MEMS1 Die Manufacturing, Motorola Semiconductor Products Sector, Phoenix, AZ • Develop device technology for absolute and differential pressure sensors for automotive, consumer and medical applications • Improve yield in bulk micromachined pressure sensor and surface micromachined accelerometer platforms • Develop modules for CMOS integration of pressure sensors • Investigate new materials for pressure sensors • Failure analysis of sensors in manufacturing line

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