About myself

With over 20 years in process and failure analysis, I excel in managing material preparation and wet labs. As a leader in Failure Analysis, I've authored papers on GaAs device decapsulation and excel in semiconductor package and die level analysis.

Job Description

I am eager to focus on developing destructive failure analysis techniques for emerging semiconductor technologies, leveraging my expertise to innovate and advance the field in a dynamic and forward-thinking environment.

How to contact