Samsung ElectronicsTelematics Technical Lead for Automotive SoC's, Modem Platform Team Samsung S.LSI
Nov. 2019 - Feb. 2023Hwaseong, Gyeonggi, South KoreaEmbedded Software RIL/HAL Lead for Telematics Control Unit (TCU)
Integrated telephony layer features such as RILD, OFONO applications, and various executable libraries to automotive system chip-set.
Managed control command transmission between UI and chip-set through D-Bus/OFONO/RIL interface.
Developed and debugged OFONO and RIL for Automotive telephony framework features including E-call, NG E-call, and IMS Call/SMS
Performed Automotive TCU tests with Anritsu and Rohde and Schwarz equipment
Developed regression/integration/verification test cases for telephony features on GSM, UMTS, LTE, and 5G radio technologies
Analyzed V2X technology for chipset development covering various communication messages including BSM, SPaT, MAP, TIM, DENM, CAM
Phase one of the automotive project was a success and phase two is going on.
Familiar with ITS protocol stack, ETSI, SAE, and 3GPP REL/14/15/16 standards
Familiar with ISO 26262 / SAE J2980 functional safety standards including Automotive Safety Integrity Levels (ASIL)
MBIM interface design and development for PC module embedded telephony systems
Key Technologies: Telematics Control Unit (TCU), C-V2X, D-bus, OFONO, RIL, WAVE, DSRC, side-link communication, Cellular communication protocols (e.g. LTE, 5G, etc.)
Tools: Coverity, Swarm, Polarion, Yocto, JIRA, Git/Gerrit, R&S CMW 500
Interests: Autonomous vehicles, Drones, and Flying cars